Customized Silicon Filters
We use monocrystalline, highly polished Czochralski silicon wafers as the starting material for our filters. During processing, we place particular emphasis on homogeneity and cleanliness.
The following specifications are variably possible:
- wafer thickness: 180, 300, 500 µm
- manufacturing process: UKP laser drilling process (patent granted 11/2021)
- pore size range: 1000 - 15 µm
- pore arrangement: freely selectable (hexagonal, square)
- individual filter assembly: square/round with variable diameters from 15 cm to 5 mm
- laser marking or interruption of the pores, if required (e.g. tweezers recess)